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 TPCA8128
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOS )
TPCA8128
Lithium Ion Battery Applications Power Management Switch Applications
8
Unit: mm
1.27 0.4 0.1 5 0.05 M A
* * * *
Small footprint due to compact and slim package Low leakage current : IDSS = -10 A (max) (VDS = -30 V) Enhancement mode : Vth = -0.8 to -2.0 V (VDS = -10 V, ID = -0.5 m A )
0.95 0.05 1 6.0 0.3 5.0 0.2
Low drain-source ON resistance : RDS (ON) = 3.7 m (typ.)
0.15 0.05
4
0.595 A
5.0 0.2
Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 k) Gate-source voltage Drain current DC Pulse (Note 1) (Note 1)
Symbol VDSS VDGR VGSS ID IDP PD PD PD EAS IAR Tch Tstg
Rating -30 -30 -25/+20 -34 -102 45 2.8 1.6 150 -34 150 -55 to 150
Unit V V V A
0.6 0.1
1
4
4.25 0.2
Drain power dissipation (Tc = 25C) Drain power dissipation (t = 10 s) (Note 2a) Drain power dissipation (t = 10 s) (Note 2b) Single pulse avalanche energy Avalanche current Channel temperature Storage temperature range (Note 3)
W
1, 2, 3: Source 5, 6, 7, 8: Drain
4: Gate
JEDEC JEITA
mJ A C C
2-5Q1A
TOSHIBA
Weight: 0.076 g (typ.)
Circuit Configuration
8 7 6 5
Note: For (Note 1), (Note 2), (Note 3), refer to the next page.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
1
2
3
0.8 0.1
8
5
3.5 0.2
1.1 0.2
Absolute Maximum Ratings (Ta = 25C)
S
0.05 S
0.166 0.05
4
This transistor is an electrostatic-sensitive device. Handle with caution.
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2010-01-07
TPCA8128
Thermal Characteristics
Characteristics Thermal resistance, channel to case (Tc = 25 ) Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Thermal resistance, channel to ambient (t = 10 s) (Note 2b) Symbol Rth (ch-c) Rth (ch-a) Rth (ch-a) Max 2.78 44.6 C/W 78.1 Unit C/W
Marking (Note 4)
TPCA 8128
Type
Lot No.
Note 1: The channel temperature should not exceed 150C during use. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b)
FR-4 25.4 x 25.4 x 0.8 (Unit: mm)
FR-4 25.4 x 25.4 x 0.8 (Unit: mm)
(a)
(b)
Note 3: VDD = -24 V, Tch = 25C (initial), L = 100 H, RG = 25 , IAR = -34 A Note 4: Weekly code: (Three digits) Week of manufacture (01 for first week of a year, continues up to 52 or 53) Year of manufacture (The last digit of the calendar year)
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TPCA8128
Electrical Characteristics (Ta = 25C)
Characteristics Gate leakage current Drain cut-off current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Input capacitance Reverse transfer capacitance Output capacitance Rise time Symbol IGSS IDSS V (BR) DSS V (BR) DSX Vth RDS (ON) Ciss Crss Coss tr ton tf toff Qg Qgs1 Qgd 0V VGS -10 V 4.7 ID = -17A Output RL = 0.88 VDS = -10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 20 V, VDS = 0 V VDS = -30 V, VGS = 0 V ID = -10 mA, VGS = 0 V ID = -10 mA, VGS = 10 V (Note 5) VDS = -10 V, ID = -0.5mA VGS = -4.5 V, ID = -17 A VGS = -10 V, ID = -17 A Min -30 -21 -0.8 Typ. 5.1 3.7 4800 800 900 11 Max 100 -10 -2.0 6.7 4.8 pF Unit nA A V V m
Turn-on time Switching time Fall time
21
ns
VDD -15 V Duty 1%, tw = 10 s
135
Turn-off time Total gate charge (gate-source plus gate-drain) Gate-source charge 1 Gate-drain ("Miller") charge

390 115 11 30
nC
VDD -24 V, VGS = -10 V ID = -34 A
Source-Drain Ratings and Characteristics (Ta = 25C)
Characteristics Drain reverse current Forward voltage (diode) Pulse (Note 1) Symbol IDRP VDSF Test Condition IDR = -34 A, VGS = 0 V Min Typ. Max -102 1.2 Unit A V
Note 5: VDSX mode (the application of a plus voltage between gate and source) may cause decrease in maximum rating of drain-source voltage.
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TPCA8128
ID - VDS
-50 -10 -3.6 -3 -2.8 -2.6 -4.5 Common source Ta = 25C Pulse test -100 -10 -3.2
ID - VDS
-3 -3.4 -3.8 -4.5 Common source Ta = 25C Pulse test -2.8
(A)
ID
-30
ID
(A)
-40
-2.5
-80
Drain current
Drain current
-2.4
-60
-2.6
-2.5 -2.4
-20
-2.3 -2.2 -2.1
-40
-10
-20
-2.3 -2.2
0
0
-0.4
-0.8
-1.2
VGS = -2 V -2 -1.6
0
VGS = -2.1 V 0 -1 -2 -3 -4
Drain-source voltage
VDS
(V)
Drain-source voltage
VDS
(V)
ID - VGS
-100
VDS - VGS
-0.5
(A)
-80
VDS (V)
Common source VDS = -10 V Pulse test
-0.4
Common source Ta = 25C Pulse test
ID
Ta = -55C -60 25 100
-40
Drain-source voltage
-0.3
Drain current
-0.2 ID = -34 A -0.1 -8.5 0 0 -4 -8 -12 -16 -20 -17
-20
0
0
-1
-2
-3
-4
Gate-source voltage
VGS
(V)
Gate-source voltage
VGS
(V)
RDS (ON) - ID
100 Common source Ta = 25C Pulse test
Drain-source ON-resistance RDS (ON) (m)
10 -4.5
VGS = -10 V
1 -0.1
-1
-10
-100
Drain current
ID
(A)
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TPCA8128
RDS (ON) - Ta
10 -100
IDR - VDS (A)
-10 -4.5 -10 -1 VGS = 0 V -3
Common source Pulse test
Drain-source ON-resistance RDS (ON) (m)
8 ID = -8.5, -17, -34 A 6 VGS = -4.5 V 4 VGS = -10 V ID = -8.5, -17, -34 A
Drain reverse current
IDR
-1
2
Common source Ta = 25C Pulse test -0.1 0 0.2 0.4 0.6 0.8 1 1.2
0 -80
-40
0
40
80
120
160
Ambient temperature
Ta
(C)
Drain-source voltage
VDS
(V)
Capacitance - VDS
10000 -2
Vth - Ta Vth (V) Gate threshold voltage
Ciss
(pF)
-1.6
-1.2
Capacitance
C
1000 Coss Crss Common source VGS = 0 V f = 1 MHz Ta = 25C -1 -10 -100
-0.8 Common source VDS = -10 V ID = -0.5mA Pulse test -40 0 40 80 120 160
-0.4
100 -0.1
0 -80
Drain-source voltage
VDS
(V)
Ambient temperature
Ta
(C)
Dynamic input/output characteristics
-30
VDS (V)
-25
VDS = -24 V
-30 Common source ID = -34 A Ta = 25C -25 Pulse test -20 VGS
-20
Drain-source voltage
-15 -12 -6 -10 -6 -5 -12
-15
VDD = -24 V
-10
-5
0
0
40
80
120
160
0
Total gate charge
Qg
(nC)
Gate-source voltage
VGS
(V)
5
2010-01-07
TPCA8128
rth - tw
1000 (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) (3) Tc = 25 (2)
Transient thermal impedance rth (C/W)
100
(1)
10 (3) 1
Single Pulse 0.1 0.001 0.01 0.1 1 10 100 1000
Pulse width
tw
(s)
PD - Ta
3
(1)Device mounted on a glass-epoxy
PD - Tc
50
(W)
2.5
(1)
(2)Device mounted on a glass-epoxy board(b) t = 10 s (Note 2b)
(W) Drain power dissipation PD
40 30 20 10 160 0
board(a)
(Note 2a)
PD Drain power dissipation
2 (2) 1.5 1 0.5 0 0
40
80
120
0
40
80
120
160
Ambient temperature
Ta
(C)
Case temperature
Tc
(C)
Safe operating area
-1000
(A)
-100
ID max (Pulse) * 1 ms * t = 10 ms *
Drain current
ID
-10 -1
-0.1 -0.1
* Single pulse Ta = 25C Curves must be derated linearly with increase in temperature. -1
VDSS max -10 -100
Drain-source voltage
VDS
(V)
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2010-01-07
TPCA8128
RESTRICTIONS ON PRODUCT USE
* Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
7
2010-01-07


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